Beckhoff at Tire Technology Expo 2013

Beckhoff will exhibit its entire range of products with automation solutions for the tire manufacturing process at booth 2081 in hall 11.3 at Tire Technology Expo from 5 to 7 February 2013.

The openness of the Beckhoff control solution permits vertical integration in the most diverse control environments or process lines and guarantees the machine manufacturer a high degree of flexibility. Beyond that the Beckhoff solution is scalable: from the use of just the I/O components up to the complete system solution including drive technology, the modular automation construction kit offers tailor-made solutions.

Panel PCs with IP 67 protection, fanless Industrial PCs and products with an extended temperature range of -25 to +60 °C are just a few of the highlights at the Beckhoff trade show booth.

Beckhoff main booth:
Hall 11.3, Booth 2081

[info]www.beckhoff.com
www.tiretechnology-expo.com [/info]

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