Automation Beckhoff

Beckhoff at Tire Technology Expo 2013

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Beckhoff will exhibit its entire range of products with automation solutions for the tire manufacturing process at booth 2081 in hall 11.3 at Tire Technology Expo from 5 to 7 February 2013.

The openness of the Beckhoff control solution permits vertical integration in the most diverse control environments or process lines and guarantees the machine manufacturer a high degree of flexibility. Beyond that the Beckhoff solution is scalable: from the use of just the I/O components up to the complete system solution including drive technology, the modular automation construction kit offers tailor-made solutions.

Panel PCs with IP 67 protection, fanless Industrial PCs and products with an extended temperature range of -25 to +60 °C are just a few of the highlights at the Beckhoff trade show booth.

Beckhoff main booth:
Hall 11.3, Booth 2081

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