Sick Vision Sensor

SICK is working with Microsoft to enable the development of commercial industrial 3D cameras

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Industrial cameras, based on technologies such as active and passive stereo, as well as 3D time-of-flight (3DToF), have been part of SICK’s standard portfolio for almost five years. Customers from various industries use the so-called 3D snapshot cameras from SICK for fast and, above all, robust and reliable acquisition of distance images and information derived upon this data. The company thus has both extensive technological, and market and application know-how to build and develop advanced 3D cameras suitable for industrial use.

Microsoft has the most extensive know-how and expertise in 3DToF measurements, with its intelligent depth technology currently being offered as part of the HoloLens mixed reality device and the Azure Kinect Development Kit.

SICK and Microsoft are working together to further expand 3DToF technologies in the context of Industry 4.0, to bring state of the art technologies to SICK’s 3DToF Visionary-T camera product line, and make it smarter, using Azure Intelligent Cloud and Intelligent Edge capabilities. Both companies are combining their strengths and make use of the resulting synergies. «By constantly improving and developing new 3D camera solutions we aim to remain the technology leader. Cooperations with companies such as Microsoft accelerate an implementation and, above all, are more cost-effectively for our customers», says Dr. Robert Bauer, Chairman of the Executive Board of SICK AG.

SICK’s latest industrial 3DToF camera Visionary-T Mini is expected to be available for sales in early 2021, while prototypes are already available now. Visionary-T Mini incorporates another variant of Microsoft’s 3D ToF technology with an impressive dynamic range and a resolution of ~510 x 420 pixels. It will offer extended performance and advanced on-device processing infrastructure and tools not currently available with Azure Kinect DK, to include, but not limited to: 24/7 robustness, industrial interfaces, enhanced resolution with sharper depth images and enhanced depth quality.


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