CNC & Tool & Mechanical Motion & Motors & Drivers SIEB & MEYER

SIEB & MEYER Provides Smart SLM Software for Drilling and Routing Machines

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During PCB production especially depth-controlled processes require an intelligent and intuitive control. Additionally to its well-proven CNC controls SIEB & MEYER implemented the optional software package SLM (Smart Layer Manager) which can meet the increasing requirements of the market regarding quality and precision of processing machines. Ernst Lenz Maschinenbau GmbH already successfully uses the smart tool.

In the PCB manufacturing the trend of a steadily increasing functional integration density of assemblies continues. Increasing signal speeds require an accurate PCB design and a high manufacturing quality. An even higher process precision is especially required for depth-controlled drilling and routing, while the number of quality-decisive parameters increases.

Additionally, corresponding manufacturing data must be collected and stored for analysis and quality control. To meet these requirements SIEB & MEYER AG has developed an optional software package SLM for the CNC 84.00 control generation. Firstly, the purpose was to meet the increasing requirements of the market regarding depth-controlled drilling and routing, for processes such as back drilling or routing residual webs. Secondly, the purpose was an innovative realization to inspire the users even in the coming years. Thirdly, an increasingly important aspect is usability: «Despite the complex functionality the operator should be able to easily and traceably configure the required process parameters,» explains Holger Dornau, Head of Sales and Marketing for CNC at the SIEB & MEYER AG.

Software package enables new possibilities

The company Ernst Lenz Maschinenbau GmbH has already decided to use the innovative software package. «We’ve been manufacturing PCB drilling and routing machines since 1968,» says Uwe Lenz, Managing Director. «Our focus is on special applications and niche solutions.» Depth-controlled PCB processing has been a standard for a long time, but the requirements towards precision get constantly higher. Hence, Lenz developed the drilling and routing machine series DRB 610-1+1 with the following functions: The board is positioned in the XY-direction by means of a CCD camera and measured with different depth measurement sensors in the Z-direction. «We use the CNC 84.00 by SIEB & MEYER which already guarantees a high level of precision, productivity and availability,» Uwe Lenz explains. «Furthermore, the SLM software makes it possible for us to detect, calculate and consider the measured board tolerances during the working process in real time.»

The SLM tool allows for a high-precision PCB processing by means of different powerful techniques which consider the PCB’s top side or bottom side or even the top of the backup material as reference plane.

The percentage mode makes it possible to additionally consider thickness deviations within the board. «Back drilling is a typical application for depth-controlled processing of PCBs,» Holger Dornau explains. «This process is used for manufacturing very expensive boards for the IT industry. Furthermore, it can also be used for depth-controlled routing of very precise embedded structures on the boards which are used in the automotive industry.»

Compensate thickness tolerances

«Our drilling and routing machines of the series DRB 610-1+1 are used for processing thick PCBs with 20 or more layers, especially required in the IT industry,» Uwe Lenz confirms. «They are, for example, used as backpanels for internet switches.» The back drilling process removes through-hole platings within holes to a certain layer in order to avoid interferences at high frequencies. Since the used PCBs are very thick and pressed several times, the thickness tolerance is very high and must be measured and compensated. The tool by SIEB & MEYER helps with this.

The software package SLM is also optimally suited for routing cavities. The background: Embedded components which are placed in the inner layers of the board are increasingly used in the electronics industry. Manufacturers are required to place a very precise and even surface with very small tolerances within the board. «Such multilayer boards are also pressed several times and the thickness tolerances must be compensated,» Uwe Lenz says. «The required tolerances are in the micrometer area. This is a challenge that can easily be met with the software provided by SIEB & MEYER.“


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