Motek/Bondexpo 2021 Automation in production and assembly

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The traditional, time-tested Motek/Bondexpo trade fair is being prepared as planned as an on-site event: The industry sector will meet at the 39th Motek international trade fair for automation in production and assembly, and the 14th Bondexpo international trade fair for bonding technology, live in Stuttgart from the 5th through the 8th of October, 2021.

Only a few days remain until exhibitors and expert visitors from the industrial automation sector will meet personally, face-to-face, to exchange ideas and experience. Motek/Bondexpo will be one of the first technical events after the exhibition-free drought and is being awaited with correspondingly great enthusiasm. Long missed, face-to-face technical discussions will once again be possible for companies in the field of industrial production and automation from the 5th of through the 8th of October. The comprehensive hygiene concept adopted by the Stuttgart Exhibition Centre, which has been extensively coordinated with the responsible authorities and implemented on the basis of the generally valid Corona Ordinance of the State of Baden-Württemberg, will provide a safe and suitable setting for the event.

Motek, together with the complementary and fully integrated Bondexpo trade fair for joining and bonding technology, is one of the most important events in the field of automation in production and assembly technology. As a leading trade fair for the world of automation, it’s the business platform with an adequate portfolio of products and services. Traditionally, the trade fair programme includes components, modules, subsystems and complete systems including robotics – all conceivable systems within the context of increasing digitalisation and automation, supported to an ever-greater extent by software and networked for the creation of integral overall systems. Expert visitors are thus supported and inspired for the implementation of digitalisation at their own companies.

“Software for Assembly” Exhibition Area

The new “Software for Assembly” exhibition area will create a platform which deals with the current issue of digitalisation in manufacturing and assembly. The “Arena of Integration” will be further developed at Motek 2021, and will evolve into the centrepiece of the new exhibition area.

Digitalisation of business processes for assembly operations will be showcased: for CAD system sales and the preparation of quotations, right on up to real-time 3D animation, from small series production based on 3D scanning and CAD processing, right on up to 3D printing in assembly operations in combination with manufacturing execution systems (MES) and digital twins of assembly systems. Where digitalised services are concerned, attention will be focused on secure Internet data transfer which will be demonstrated by means of transmission to machines in other exhibition halls. All of these solutions will be demonstrated live at the Arena of Integration.

Participants include renowned machinery manufacturers such as ThyssenKrupp Automation Engineering and Otto Bihler Maschinenfabrik with their own digitalisation solutions, as well as numerous high-tech companies who offer digitalisation solutions with exclusive features.

Special Areas for 3D Printing and Startups

The “Special Area for 3D Printing” will be set up as a thematic highlight in hall 1. Suppliers of 3D printers for industrial use, material suppliers for 3D printing and job shops for 3D printed parts and assemblies will present their solutions and services here. The range of new opportunities being opened up by 3D printing technology is the immense: engineering and design freedom, bionic and individualised structures, undercuts, overhangs and lightweight structures are made possible. In particular industry sectors that produce small series or special components benefit from this technology – for example replacement parts, fixtures, retainers and housings. The Startup Area in hall 1 extends its invitation as well in a committed and forward-looking manner. Schall trade fair promoters are purposefully providing young companies who want to present their innovative automation ideas with a suitable platform at Motek/Bondexpo, with the goal of generating feasible solutions for everyday industrial use based on their product concepts and new product presentations.

Efficient and Flexible Hairpin Production

Electromobility is in the fast lane and will reshape requirements and workflows in production processes. Motek/Bondexpo will also provide this increasingly important issue with a platform by setting up a Hairpin Motor Production Area in hall 5, where automation solutions for e-components will be exhibited. For example, Otto Bihler Maschinenfabrik will present its new BM-HP 3000 servo production system, which is opening up advanced perspectives for industrial mass production of all common types of hairpins. The machine combines all process steps into an efficient overall solution and users benefit from significantly shorter cycle times than with sequential systems, as well as from flexible scalability for future tasks.

Bondexpo – the Future-Oriented Issue of Bonding Technology

The complementary Bondexpo trade fair is fully integrated into the event concept and focuses on industrial joining and bonding technologies, which have become an indispensable tool for many industrial sectors and commercial trades. And they’ll continue to gain significance in the future as well because in comparison with alternative technologies, bonded products can improve both energy and material efficiency.


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