Teledyne FLIR will exhibit its newest Lepton® and Boson® thermal camera modules at Mobile World Congress 2022 taking place February 28 – March 3, 2022 in Barcelona, Spain.
Thermal imaging use in mobile platforms has increased significantly with millions of devices in use around the world. The latest rugged mobile phones that include the Teledyne FLIR Lepton micro thermal camera module enable thermal imaging and non-contact temperature measurement. They include the CAT S62 Pro, the world’s first 160 x 120 resolution thermal smartphone with the MyFLIR® Professional application to support completing jobs in rugged and harsh environments. The new Blackview 8800 Pro and Ulefone Armor 11T are the first thermal-enabled smartphones with 5G capability, which opens up new opportunities for sharing and streaming thermal data from the field as part of developing smart cities architecture.
The Teledyne FLIR Lepton® is a radiometric-capable LWIR OEM camera solution that is smaller than a dime, fits inside a smartphone, and is one tenth the cost of traditional IR cameras. Using focal plane arrays of either 160×120 or 80×60 active pixels, Lepton easily integrates into native mobile-devices and other electronics as an infrared sensor or thermal imager. Thanks to its small size, low cost, and innovative design, the Lepton® micro thermal camera module is ideal for building thermal imaging and non-contact temperature measurement capability into small electronic products from drones to rugged mobile phones. Millions of Leptons are in such products around the world for innumerable uses ranging from construction to public safety and industrial machine reliability monitoring.
Teledyne FLIR, working with developers, has taken those learnings to develop a new set of comprehensive online support tools to empower the next generation of designers, engineers, and developers to create new mobile devices and uses with the Lepton. Available at www.flir.com/leptonintegration, this new site features everything needed to start integrating the Lepton into handheld mobile, IoT, unmanned, or other imagined devices using Windows, Linux, Raspberry Pi, and Beaglebone platforms.
To learn more, please visit Mobile World Congress booth 7B6.
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